lead-free parts pb LSEF42940-PF super bright round type led lamps ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-LSEF42940-PF rev. : a date : 04 - aug. - 2006
25% 50% 75% 100%25% 0 -60 0 -30 100% 50%75% 60 30 3.8 3.1 4.5 3.0 2.54typ 1.0min 0.5 typ 25.0min 1.5 max + - page 1/5 package dimensions part no. LSEF42940-PF ligitek electronics co.,ltd. property of ligitek only directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) t opr tstg color lens orange diffused material part no algainp LSEF42940-PF orange emitted operating temperature storage temperature viewing angle 2 1/2 (deg) dominant wave length dnm spectral halfwidth nm forward voltage @20ma(v) luminous intensity @20ma(mcd) max. 605 min. 17 1.7 2.61100 typ. 700 min. 62 -40 ~ +85 -40 ~ +100 absolute maximum ratings at ta=25 symbol esd forward current peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) power dissipation parameter page 2/5 pd ir i fp i f 120 10 2000 90 50 sef ratings mw a v ma ma unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LSEF42940-PF
r e l a t i v e i n t e n s i t y @ 2 0 m a 550 0.0 0.5 wavelength (nm) 600650 500 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 sef chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 1.52.02.53.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only page3/5 part no. LSEF42940-PF
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2 /sec max 0 0 preheat 25 120 150 50 100 time(sec) 260 temp( c) 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max part no. LSEF42940-PF
page 5/5 description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 reliability test: high temperature storage test operating life test test item low temperature storage test the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 high temperature high humidity test solderability test solder resistance test thermal shock test part no. LSEF42940-PF
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